Ahead of the iPhone X pre-orders later this month, Fabless IC company Himax Technologies has began transport wafer-level optics (WLO) to Apple. The WLO chips are a key element for the TrueDepth digicam used within the iPhone X.
Himax has additionally partnered with ChipMOS Technologies to verify it is in a position to provide Apple with the specified quantity of WLO chips. The corporations be expecting their revenues to upward thrust considerably in the second one part of 2017 because of his. And with Android OEMs additionally running on their very own facial reputation , the call for for WLO chips are simplest going to extend in 2018 which in flip will receive advantages each Himax and ChipMOS For instance, Qualcomm’s just lately introduced three-D fingerprint scanner was once collectively evolved in affiliation with Himax.
The DigiTimes document additionally claims that Apple may extend the shipments of iPhone X or release it in restricted amounts to begin with because of yield problems. This is one thing that we’ve got been listening to time and again from quite a lot of resources with all hands being pointed on the TrueDepth/Face ID digicam module. Apple providers are suffering with the yield charges of the quite a lot of parts used within the TrueDepth digicam which is appearing as a bottleneck for the iPhone X’s manufacturing. This scarcity is predicted to ultimate neatly till the autumn of subsequent yr.
While there was a large number of hype across the TrueDepth digicam and Face ID on the iPhone X, it is still observed the way it plays in actual existence. With the iPhone X release rapid drawing near, it’s now just a subject of few weeks ahead of this query is spoke back.[Via DigiTimes]
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